playwild5pokeronline| Shennan Circuit: ABF materials can be used in the manufacture of FC-BGA packaging substrate products. The company now has the capacity to produce FC-BGA packaging substrates with 14 layers and below.

Tonghuashun (300033) Financial Research Center, April 28playwild5pokeronline, some investors asked Shennan Circuit (002916)(002916), respectplaywild5pokeronlineHello, does your company now have ABF board mass production capabilities

The company replied, Hello, Dear Investor. ABF materials can be used in the manufacturing of FC-BGA packaging substrate products. The company now has the capacity to produce FC-BGA packaging substrate products with 14 layers and below. Products with 14 layers and above have sample manufacturing capabilities. The corresponding production lines of each stage of products have been verified and imported. Work such as sample delivery certification is advanced in an orderly manner. The company will continue to accelerate the competitiveness construction of Guangzhou's FC-BGA product line and support the smooth climb of the first phase of the Guangzhou packaging substrate project. Thank you for your attention.

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